Chair
Honggang Zhang, Zhejiang University, China
Vice-Chairs
Ramachandran Ramjee, Microsoft Research India, (TCCN Vice-Chair Asia Pacific)
K.P. Suba Subbalakshmi, Stevens Institute of Technology, USA, (TCCN Vice-Chair North America)
Jaime Lloret Mauri, Polytechnic University of Valencia, Spain, (TCCN Vice-Chair Europe/Africa)
Secretary
R. Venkatesha Prasad, WMC, TUDelft
IEEE ComSoc Standards Liaison
R. Chandramouli, Stevens Inst. of Technology
WUN CogCom Liaison
David Grace, University of York
Industry Liaisons
Markus Mueck, Intel
Zander Zhongding Lei, Institute for Infocomm Research (I2R)
Iain Collings, CSIRO ICT Centre, Australia
Maziar Nekovee, BT Labs
Carlos Cordeiro, Intel
Regulatory Liaison
Reza Karimi, Ofcom
IEEE 802.22 Liaison
Apurva N. Mody, BAE Systems
IEEE DySPAN Standards Committee Liaison
Oliver Holland, King’s College London
European COST Action IC0902 Liaison
Maria-Gabriella Di Benedetto, University of Rome “La Sapienza”
European COST Action IC0905 Liaison
Oliver Holland, King’s College London
Publications Award Committee
Sumit Roy, University of Washington (Chair)
R. Chandramouli, Stevens Inst. of Technology
Preston Marshall, USC/ISI
Kiran Challapali, Philips Research
Recognition Award Committee
Petri Mähönen , RWTH Aachen University (Chair)
John Chapin, Vanu
Alexander D. Gelman, NETovations Group
Joseph Mitola III, Stevens Institute of Technology
Web Chair
Vijay Rao, Delft University of Technology, the Netherlands