March 2021 edition of the TCCN Newsletter available
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While 5G is a reality and has already been commercially launched in several parts of the world, there exist already numerous efforts and initiatives from industry and academia to look beyond 5G and conceptualize 6G by describing its roadmap along with the emerging trends and requirements, as well as several enabling techniques and architectures. Future wireless systems should effectively support a universal and ubiquitous cyber physical structure, new spectrum access schemes, and new forms of communications, while taking into account the energy efficiency and security/privacy considerations.
Two promising technologies for enabling the 6G ecosystem are full-duplex (FD) communications and integrated space-air-terrestrial communication (ISATC) systems. In this regard, this Newsletter will delve on these two key technologies for 6G wireless networks. In the FD communications area, we have interviewed Mr. Kenneth Kolodziej, from MIT Lincoln Laboratory, USA, Prof. Ioannis Krikidis, from University of Cyprus, Cyprus, Prof. Özgür Gürbüz, from Sabanci University, Turkey, and Prof. Chan-Byoung Chae, from Yonsei University, South Korea. We have also had the pleasure to get two position papers written by Prof. Alexios Balatsoukas-Stimming, from Eindhoven University of Technology, Netherlands, and by Prof. Jeyanandh Paramesh, from Carnegie Mellon University, USA, Susnata Mondal, from Intel Inc., and Ahmed Alkhateeb, from Arizona State University, USA. Within the context of ISATC systems, we have interviewed Prof. Pei Xiao, from the University of Surrey, UK, Prof. Mohamed-Slim Alouini from King Abdullah University of Science and Technology, Saudi Arabia, and Prof. Jianping An, from Beijing Institute of Technology, China, who provided us with their outlook on the opportunities and challenges on the theme.
I would like to thank our two feature topic editors: Prof. Himal A. Suraweera, from University of Peradeniya, Sri Lanka, and Prof. Gaofeng Pang, from Beijing Institute of Technology, China, for their hard efforts in arranging the content of this Newsletter. Moreover, we want to thank all authors and interviewees for sharing with us their experience and time. I would finally like to acknowledge the gracious support from the previous TCCN Chair, Dr. Yue Gao, from the current TCCN Chair, Prof. Lingyang Song, and from all TCCN officers. If you have any suggestion, feel free to contact me at: email@example.com. We hope that you enjoy the material of this Newsletter!
Daniel Benevides da Costa
Director, IEEE ComSoc TCCN Newsletter
Federal University of Ceará, Brazil