Chair
David Grace, University of York, United Kingdom
Vice-Chairs
Kandeepan Sithamparanathan, RMIT, Australia (TCCN Vice-Chair Asia Pacific)
Ekram Hossain (University of Manitoba, Canada) (TCCN Vice-Chair North America)
R. Venkatesha Prasad, Delft University of Technology, Netherlands (TCCN Vice-Chair Europe/Africa)
Secretary
Periklis Chatzimisios, Alexander TEI of Thessaloniki, Greece
IEEE ComSoc Standards Liaison
R. Chandramouli, Stevens Inst. of Technology
WUN CogCom Liaison
David Grace, University of York
Industry Liaisons
Markus Mueck, Intel
Zander Zhongding Lei, Institute for Infocomm Research (I2R)
Iain Collings, CSIRO ICT Centre, Australia
Maziar Nekovee, BT Labs
Carlos Cordeiro, Intel
Regulatory Liaison
Reza Karimi, Ofcom
IEEE 802.22 Liaison
Apurva N. Mody, BAE Systems
IEEE DySPAN Standards Committee Liaison
Oliver Holland, King’s College London
European COST Action IC0902 Liaison
Maria-Gabriella Di Benedetto, University of Rome “La Sapienza”
European COST Action IC0905 Liaison
Oliver Holland, King’s College London
Web Chair
Vijay Rao, Delft University of Technology, the Netherlands