Bala Natarajan, Kansas University, USA
Beibei Wang, Qualcomm, USA
Carlos Cordeiro, Intel, USA
Changkun Jiang, The Chinese University of Hong Kong
Charles Clancy, Virginia Tech, USA
Chen Qian, I2R, Singapore
Chia-Han Lee, Academic Sinica
Danijela Cabric, UCLA, USA
David Grace, University of York, UK
Ekram Hossain, University of Manitoba, Canada
Eryk Dutkiewicz, Macquarie University, Australia
Fen Hou, University of Macau, China
Fengye Hu, Jilin University, China
Frank Y. Li, University of Adger, Norway
Giorgio Quer, UCSD, USA
Guodong Zhao, UESTC, China
Hao Wang, The Chinese University of Hong Kong
Jianwei Huang, The Chinese University of Hong Kong, China
Jie Li, University of Tsukuba, Japan
Jinsong Wu, Bell Laboratories, China
Junlin Yu, The Chinese University of Hong Kong
K.P. (Suba) Subbalakshmi, Stevens Institute of Technology, USA
Kwang-Cheng Chen, National Taiwan University, Taiwan
Liang Zhou, Nanjing University of Posts and Telecommunications, China
Linda Doyle, Trinity College Dublin, Ireland
Lingjie Duan, Singapore University of Technology and Design, Singapore
Lingyang Song, Peking University, China
Liqun Fu, KTH Sweden
Man Hon Cheung, The Chinese University of Hong Kong
Michele Zorzi, University of Padova, Italy
Natasha Devroye, UIC, USA
Nordin Ramli, MIMOS Malaysia
Octavia Dobre, Memorial University, Canada
Oliver Holland, King’s College London, UK
Pan Li, Mississippi State University, USA
Periklis Chatzimisios, Alexander TEI of Thessaloniki,Greece
Petar Popovski, Aalborg University, Denmark
Shui Yu, Deakin University, Australia
Song Guo, University of Aizu, Japan
Taewon Hwang, The Chinese University of Hong Kong, China
Takeo Fujii, University of Electro-Communications, Japan
Thomas Hou, Virginia Tech, USA
R. Venkatesha Prasad, Delft University of Technology, Netherlands
Vijay Rao, Delft University of Technology, Netherlands
Walid Saad, Virginia Tech, USA
Wei Jiang, University of Duisberg-Essen, Germany
Wei Zhang, University of New South Wales, Australia
Xiangwei Zhou, Louisiana State University, USA
Xin Liu, UC Davis, USA
Ying-Chang Liang, Institute for Infocomm Research (I2R), A*STAR, Singapore
Yuan Luo, The Chinese University of Hong Kong
Yue Gao, Queen Mary University of London, UK
- Home
- Officers
- News
- Meetings
- IEEE Globecom 2024
- IEEE ICC 2024
- IEEE GLOBECOM 2023
- IEEE ICC 2023
- IEEE Globecom 2022
- IEEE ICC 2022
- IEEE Globecom 2021
- IEEE ICC 2021
- IEEE Globecom 2020
- IEEE ICC 2020
- IEEE Globecom 2019
- IEEE ICC 2019
- IEEE Globecom 2018
- IEEE ICC 2018
- IEEE Globecom 2017
- IEEE ICC 2017
- IEEE Globecom 2016
- IEEE ICC 2016
- IEEE Globecom 2015
- IEEE ICC 2015
- IEEE Globecom 2014
- IEEE ICC 2014
- IEEE Globecom 2013
- IEEE ICC 2013
- IEEE Globecom 2012
- IEEE ICC 2012
- IEEE Globecom 2011
- IEEE ICC 2011
- IEEE Globecom 2010
- IEEE ICC 2010
- IEEE Globecom 2009
- IEEE ICC 2009
- IEEE Globecom 2008
- IEEE ICC 2008
- IEEE Globecom 2007
- IEEE ICC 2007
- CrownCom 2007
- IEEE Globecom 2006
- Awards
- IEEE ComSoc TCCN Publication Award 2024
- IEEE ComSoc TCCN Recognition Award 2024
- IEEE ComSoc TCCN Publication Award 2023
- IEEE ComSoc TCCN Recognition Award 2023
- IEEE ComSoc TCCN Publication Award 2022
- IEEE ComSoc TCCN Recognition Award 2022
- IEEE ComSoc TCCN Publication Award 2021
- IEEE ComSoc TCCN Recognition Award 2021
- IEEE ComSoc TCCN Publication Award 2020
- IEEE ComSoc TCCN Recognition Award 2020
- IEEE ComSoc TCCN Recognition Award 2019
- IEEE ComSoc TCCN Publication Award 2019
- IEEE ComSoc TCCN Recognition Award 2018
- IEEE ComSoc TCCN Publication Award 2018
- IEEE ComSoc TCCN Recognition Award 2017
- IEEE ComSoc TCCN Publication Award 2017
- SIGs
- Call for Papers
- Newsletter
- Membership
- Seminars
- Mailing List
- Journals