Daniel Benevides da Costa, Federal University of Ceará (UFC), Brazil
Danijela Cabric, University of California, Los Angeles, USA
Eirini-Eleni Tsiropoulou, University of New Mexico, USA
Fengye Hu, Jilin University, China
Frank Y. Li, University of Adger, Norway
Geoffrey Li, Georgia Institute of Technology, USA
Jianwei Huang, The Chinese University of Hong Kong, China
Jinsong Wu, University of Chile, Chile
K. P. (Suba) Subbalakshm, Stevens Institute of Technology, USA
Kai Yang, Tongji University, China
Li Wang, Beijing University of Posts and Telecommunications, China
Li-Chun Wang, National Chiao-Tung University, Taiwan
Lin Gao, Harbin Institute of Technology, Shenzhen, China
Lingyang Song, Peking University, China
Markus Dominik Mueck, Intel Mobile Communications, Germany
Michele Zorzi, University of Padova, Italy
Ning Zhang, University of Windsor, Canada
Octavia Dobre, Memorial University, Canada
Oliver Holland, Kings College London, UK
Qian Zhang, Hong Kong University of Science and Technology, China
Qiang Ni, Lancaster University, UK
Rahim Tafazolli, University of Surrey, UK
Rui Zhang, National University of Singapore, Singapore
Scott Fowler, Linkoping University, Sweden
Shiwen Mao, Auburn University, USA
Venkatesha Prasad, Delft University of Technology, The Netherlands
Vijay Rao, Delft University of Technology, The Netherlands
Vincent W.S. Chan, MIT, USA
Walid Saad, Virginia Tech, USA
Wei Zhang, University of New South Wales, Sydney, Australia
Xianghui Cao, Southeast University, Nanjing, China
Xiangwei Zhou, Louisiana State University, USA
Y-W Peter Hong, National Tsing Hua University, Taiwan
Yao Ma, NIST, USA
Ying-Chang Liang, University of Electronic Science and Technology of China, China
Yuan Ma, Shenzhen University, China
Yue Gao, University of Surrey, UK
Yulei Wu, University of Exeter, UK
Zhi Tian, George Mason University, USA
Zhijin Qin, Queen Mary University of London, UK
- Home
- Officers
- News
- Meetings
- IEEE ICC 2024
- IEEE GLOBECOM 2023
- IEEE ICC 2023
- IEEE Globecom 2022
- IEEE ICC 2022
- IEEE Globecom 2021
- IEEE ICC 2021
- IEEE Globecom 2020
- IEEE ICC 2020
- IEEE Globecom 2019
- IEEE ICC 2019
- IEEE Globecom 2018
- IEEE ICC 2018
- IEEE Globecom 2017
- IEEE ICC 2017
- IEEE Globecom 2016
- IEEE ICC 2016
- IEEE Globecom 2015
- IEEE ICC 2015
- IEEE Globecom 2014
- IEEE ICC 2014
- IEEE Globecom 2013
- IEEE ICC 2013
- IEEE Globecom 2012
- IEEE ICC 2012
- IEEE Globecom 2011
- IEEE ICC 2011
- IEEE Globecom 2010
- IEEE ICC 2010
- IEEE Globecom 2009
- IEEE ICC 2009
- IEEE Globecom 2008
- IEEE ICC 2008
- IEEE Globecom 2007
- IEEE ICC 2007
- CrownCom 2007
- IEEE Globecom 2006
- Awards
- IEEE ComSoc TCCN Publication Award 2024
- IEEE ComSoc TCCN Recognition Award 2024
- IEEE ComSoc TCCN Publication Award 2023
- IEEE ComSoc TCCN Recognition Award 2023
- IEEE ComSoc TCCN Publication Award 2022
- IEEE ComSoc TCCN Recognition Award 2022
- IEEE ComSoc TCCN Publication Award 2021
- IEEE ComSoc TCCN Recognition Award 2021
- IEEE ComSoc TCCN Publication Award 2020
- IEEE ComSoc TCCN Recognition Award 2020
- IEEE ComSoc TCCN Recognition Award 2019
- IEEE ComSoc TCCN Publication Award 2019
- IEEE ComSoc TCCN Recognition Award 2018
- IEEE ComSoc TCCN Publication Award 2018
- IEEE ComSoc TCCN Recognition Award 2017
- IEEE ComSoc TCCN Publication Award 2017
- SIGs
- Call for Papers
- Newsletter
- Membership
- Seminars
- Mailing List
- Journals
- Elections